HUAJIAYU at CIOE 2026: AI Computing Drives DWDM and High-Density Optical Devices to Mass Production

From September 9 to 11, 2026, the 27th China International Optoelectronic Exposition (CIOE 2026) brought together more than 4,000 optoelectronic enterprises at the Shenzhen World Exhibition & Convention Center. AI-powered high-speed optical interconnect stood out as the defining theme of the show, and Guangdong HUAJIAYU Optical Communication Technology Co., Ltd. (HUAJIAYU / HJY) joined the exhibition to present its CWDM/DWDM component capabilities for the next generation of AI data centers.

Shenzhen, China — September 2026

The stringent requirements of AI computing clusters for bandwidth, power consumption and latency are reshaping the entire optical device industry. 800G optical modules have reached large-scale commercial deployment, while 1.6T products have moved beyond sampling and entered the mass ramp-up stage. Attention has already shifted to next-generation solutions including 400G per wavelength and 3.2T. Beyond pluggable transceivers, technical routes such as NPO, CPO, LPO and XPO competed side by side, each seeking the optimal implementation path for short-range interconnect inside computing racks.

For the DWDM industrial chain, CIOE 2026 delivered a clear signal: high-speed wavelength division devices are no longer required to meet only lab-level specifications. Overseas clients have raised stricter requirements on spectral performance, port reflection metrics, parameter consistency and yield. During sample delivery of 200G DWDM and 2*2 integrated optical devices, a growing number of overseas buyers now request complete OSA spectral test data before shipment — a practice that has become standard for sample handover. Buyers no longer focus only on insertion loss; demands for pre-delivery review of return loss, crosstalk and spectral flatness keep rising, forcing component manufacturers to strengthen pre-production testing and data delivery workflows.

Several technical routes are converging to support cost and performance optimization for high-speed DWDM modules, while passive wavelength division devices evolve toward miniaturization, high channel density and low reflection:

• Silicon photonics integration for compact, high-throughput engines
• Thin-film lithium niobate modulators for high-bandwidth modulation
• High-power continuous-wave lasers for stable, efficient pumping
• Low-reflection, high-density passive devices for intra-data-center interconnection

Demand for 2*2 and multi-port integrated devices is growing rapidly as intra-data-center interconnection scenarios expand.

The industry still faces practical challenges: yield control of high-speed components, packaging and coupling processes, parameter consistency of mass-produced products, and increasingly strict pre-shipment test document reviews requested by overseas customers.

As a manufacturer dedicated to the complete CWDM/DWDM industrial chain — from raw materials to finished products — HUAJIAYU supports this shift with in-house optical filter design, high-volume manufacturing capacity of up to 50K units per month, and a testing discipline built around full spectral data delivery. For sample submissions of 200G DWDM and 2*2 integrated devices, HUAJIAYU provides complete OSA spectral test records covering insertion loss, return loss, crosstalk and spectral flatness, helping overseas customers shorten their verification cycle and approve samples with confidence.

Capital expenditure on AI computing will continue to fuel demand for high-speed optical interconnect. DWDM and high-density integrated optical devices are expected to see order growth alongside the ramp-up of 1.6T modules. Technical verification, sample submission and pre-shipment spectral data review will become regular steps in future business communications — and vendors with a robust capability for delivering complete test data will build a durable competitive advantage when engaging overseas customers.